Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Laser cutting — process on a sheet of steel. CAD (top) and stainless steel laser cut part (bottom) Laser cutting is a technology that uses a laser to cut materials, an … Wikipedia
coupage des tranches par laser — lazerinis plokštelių pjaustymas statusas T sritis radioelektronika atitikmenys: angl. laser wafer dicing vok. Lasertrennen von Wafern, n rus. лазерная резка пластин, f pranc. coupage des tranches par laser, m … Radioelektronikos terminų žodynas
Lasertrennen von Wafern — lazerinis plokštelių pjaustymas statusas T sritis radioelektronika atitikmenys: angl. laser wafer dicing vok. Lasertrennen von Wafern, n rus. лазерная резка пластин, f pranc. coupage des tranches par laser, m … Radioelektronikos terminų žodynas
lazerinis plokštelių pjaustymas — statusas T sritis radioelektronika atitikmenys: angl. laser wafer dicing vok. Lasertrennen von Wafern, n rus. лазерная резка пластин, f pranc. coupage des tranches par laser, m … Radioelektronikos terminų žodynas
лазерная резка пластин — lazerinis plokštelių pjaustymas statusas T sritis radioelektronika atitikmenys: angl. laser wafer dicing vok. Lasertrennen von Wafern, n rus. лазерная резка пластин, f pranc. coupage des tranches par laser, m … Radioelektronikos terminų žodynas
Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
Mirror galvanometer — A mirror galvanometer A mirror galvanometer is a mechanical meter that senses electric current, except that instead of moving a needle, it moves a mirror. The mirror reflects a beam of light, which projects onto a meter, and acts as a long,… … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia